Heat Sink Bonding Systems

Optimum heat dissipation by means of cold bonding

Heat sink bonding systems are particularly suited for the use of multilayer PCBs. Most applications to date have used thermal pads, thermal vias, component cooling elements and fans. These solutions usually resulted in insufficient or cost-intensive heat dissipation. Our bonding systems for optimum heat removal was specially developed with this problem in mind. Where mechanical stability and optimum heat dissipation are essential conditions, our heat sink bonding systems are the optimum choice.

Features:

Sustained temperatures of up to -40°C to +150°C possible

High stability of the mechanical carrier

Indentations in the mechanical carrier possible

Cost-effective alternative to thick-film technology

Easy processing for assembly and soldering

Minimum load on components and solder joints when subjected to fluctuations in temperature

Ideal for multilayer PCBs

Extremely long service life, proven in the automotive industry