IMS – Insulated Metal Substrate

Unrestricted design freedom

Thanks to our IMS technology, you can dissipate heat efficiently and cost-effectively with a thermal conducting link. This results in highly stable IMS printed circuit boards, which in turn improves your packing density options. Thanks to our IMS technology, power LED components, for example, achieve maximum performance without reducing the service life of the LEDs.

As an IMS manufacturer from the very outset, we have a wealth of experience in the manufacture of special PCBs. We continually develop new products that not only expand the range of applications but also consistently enhance typical IMS attributes.

Enjoy the benefits of IMS technology

Excellent heat conductivity properties up to 14 W/mK

Excellent freedom of design

Patented LED/COB application

Cost-effective alternative to thick film technology

Sequential build-up of layers on the carrier (aluminium/copper) up to a maximum of 3 layers possible

Carrier thicknesses from 0.8 mm to 3.0 mm possible (aluminium/copper)