Telecom

BGAs with over 500 pins and landgrid arrays with a pin grid of 0.5 mm are processed on this component. The manufacture of the double-sided inserted and reflow soldered assembly has been simplified by the use of pressfit technology. Product-specific test adapters were produced to guarantee correct functionality.

Facts

Onboard programming

Processing of BG and landgrid components

Pressfit assembly technology

Test infrastructure for Telecom