Sprache

Heatsink Leiterplatten für optimales Wärmemanagement

Our services

Engineering

  • Circuit design
  • Optimised heat management through suitable material selection
  • Heat management simulation for the specified application area
  • Project management within the framework of the certification regulations
  • Analysis of customer requirements
  • Design for production and test
  • Layout design reworking
  • Verification of customer specifications

PCB layout

  • Analysis of customer requirements
  • Design for production and test
  • Layout design reworking
  • Verification of customer specifications

Logistics & procurement

We ensure that the defined materials are procured in a professional and timely manner at the accordant market prices. You therefore profit from our considerable purchasing volumes and our international network (Asetronics Asia Pacific Ltd, Hong Kong).

Production

  • Manufacturing the cores using materials aligned with the respective customer needs
  • Blind hole technology
  • Modern surface coatings (chem. Ni/Au, IP-Au, Sn, OSP…)
  • High-precision, mechanical processing centres (4-axis system)
  • Fully automatic test systems

After Sales Service

  • Implementation of change orders
  • Redesign
  • Evaluation of alternative materials