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BGAs with over 500 pins and landgrid arrays with a pin grid of 0.5 mm are processed on this component. The manufacture of the double-sided inserted and reflow soldered assembly has been simplified by the use of pressfit technology. Product-specific test adapters were produced to guarantee correct functionality.
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Facts
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Onboard programming.
Processing of BG and landgrid components.
Pressfit assembly technology.
Test infrastructure for Telecom.
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