Heat Management

To meet stringent demands, critical points must be detected early and appropriate solutions must be developed.

This calls for an efficient development process:

• electronic circuit design, creation of the PCB layout, preparation of data for PCB production,
• provision of parts lists and the necessary information for acquiring components,
• the design of mechanical parts and preparation of CAD data for manufacturing parts must be precisely coordinated.

It must be possible to answer the two central questions:
How can heat be efficiently dissipated theoretically on the assembly, and how can it be verified through measurements.

A critical value is the junction temperature in the LED which must be below the maximum temperature specified in all operating modes.

With the help of FEM simulations we are able to model thermal conditions during the design stage. In a relatively short amount of time we are able to provide customers with an overview of the current heat management situation in order to discuss other suggestions – before prototypes are built.

We use an integrated development environment for modeling any combinations of physical effects such as heat propagation, electromagnetics and mechanics. This system enables thermal simulations to be performed, from power LED assemblies through to the entire housing. A specific strength of the system is that all propagation mechanisms such as thermal conduction, convection and radiation can be combined.